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IBM eServer p655

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Designed to provide data-center-class capacity, performance and RAS, the POWER4+™ processors in the pSeries 670 utilize "SMP-on-a-chip" design. At 1.50GHz, this processor ranks among the fastest 64-bit chips in the world1. Because they also incorporate copper and silicon-on-insulator (SOI) technology, POWER4+ processors consume less power—saving energy while delivering high reliability and outstanding performance. Customers with an existing POWER4™ pSeries 670 system can upgrade to a POWER4+ configuration to boost application speed and throughput for growing workload needs.
Innovative CPU packaging also contributes to enterprise-class performance and reliability from the pSeries 670. Advanced Multichip Module (MCM) architecture, similar to the design used in IBM eServer zSeries® servers, places up to eight microprocessors in a single MCM so small that it can fit in the palm of your hand. To further enhance performance, 128MB of Level 3 (L3) cache is packaged with the MCM. L3 cache helps stage information more effectively from processor memory to application programs. By decreasing the physical distance between components, MCMs enable faster movement of information—resulting in greater speed and improved reliability compared with earlier, less dense component configurations.

Additional "book" packaging for memory also enhances reliability by helping to protect components from electrostatic discharge and physical damage. With space for up to eight memory books per server, the pSeries 670 offers up to a 16-way configuration with 4GB to 256GB of total memory—providing tremendous processing power for both commercial and technical workloads.

The unique system architecture of the pSeries 670 enables it to deliver efficient, cost-effective data sharing and application throughput. Designed to support the incredible speed of the processors, the pSeries 670 design also features a peak aggregate memory-to-L3 cache bandwidth of 102.4GB/sec in a 16-way configuration. In addition, the server can deliver an aggregate I/O subsystem bandwidth of up to 14GB/sec.

IBM p655 Specifications
 
Minimum server configuration
Processor drawer (4U)
Microprocessor: 4-way 1.70GHz POWER4+ SMP (one 4-way MCM); or 8-way 1.70GHz POWER4+ SMP (one 8-way MCM)
RAM (memory): 4GB
Internal disk drive: Two 36.4GB Ultra320 SCSI
Internal disk bays: Two hot-swappable; up to 293.6GB (36.4GB, 73.4GB and 146.8GB disk drives available)
Expansion slots: Three hot-plug/blind-swap PCI-X (64-bit)
PCI bus width: 32- and 64-bit
 
Standard features
I/O adapters: Two integrated Ultra320 SCSI controllers
Integrated ports: Two 10/100 Ethernet; two serial ports for connecting Hardware Management Console
 
Server expansion
RAM: Up to 64GB (ECC, Chipkill)
 
System (frame) expansion
p655 server drawer: Up to 16 half drawers per frame
I/O drawer: Up to five per frame (one per pSeries 655 server)
Optional battery backup: Up to six per frame
 
I/O drawer - 7040-61D (4U) Maximum of one per pSeries 655
I/O slots: 20 hot-plug/blind-swap PCI or PCI-X slots (64-bit)
Disk bays: Up to 16 hot-swappable Ultra3 SCSI disk bays; up to 2.0TB (36.4GB, 73.4GB and 146.8GB disk drives available)
 
Cluster features
Cluster attachment: CSM v1.3 with AIX 5L v5.2

CSM v1.3 with Linux on pSeries

PSSP v3.5 with AIX 5L v5.1/5.2
Cluster Interconnect: Ethernet (CSM and AIX 5L or Linux; PSSP and AIX 5L)

High Performance Switch (CSM and AIX 5L)

SP Switch2 (PSSP and AIX 5L)
 
RAS features: Copper, SOI microprocessors

Chipkill ECC, bit-steering memory

ECC L2 cache, L3 cache

Service processor

Hot-swappable disk bays

Hot-plug/blind-swap PCI/PCI-X slots

Dynamic Processor Deallocation

Dynamic deallocation of logical partitions and PCI bus slots

Battery backup (optional)

UPS (optional)
 
Operating system: AIX 5L Versions 5.1/5.2

Selected Linux distributions*
 
Power requirements: 200 to 240v; 380 to 415v; 480v AC
 
System frame dimensions: 79.7"H x 30.9"W x 56.8"D (202.5 cm x 78.5 cm x 144.3 cm); Weight: 3,613 lb (1,642 kg)**
 
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